BSL802SN optimos?2 small-signal-transistor features ? n-channel ? enhancement mode ? ultra logic level (1.8v rated) ? avalanche rated ? qualified according to aec q101 ? 100% lead-free; rohs compliant ? halogen free according to iec61249-2-21 maximum ratings, at t j =25 c, unless otherwise specified parameter symbol conditions unit continuous drain current i d t a =25?c 7.5 a t a =70?c 6.0 pulsed drain current i d,pulse t a =25?c 30 avalanche energy, single pulse e as i d =7.5?a, r gs =25? w 30 mj reverse diode d v /d t d v /d t i d =7.5?a, v ds =16?v, d i /d t =200?a/s, t j,max =150?c 6 kv/s gate source voltage v gs 8 v power dissipation 1) p tot t a =25?c 2 w operating and storage temperature t j , t stg -55 ... 150 c esd class jesd22-a114 -hbm 0 (<250v) soldering temperature 260 c iec climatic category; din iec 68-1 55/150/56 value pg - tsop6 1 2 3 4 5 6 v ds 20 v r ds(on),max v gs =2.5 v 22 m w v gs =1.8 v 31 i d 7.5 a product summary type package tape and reel information marking lead free packing BSL802SN pg - tsop6 h6327: 3000 pcs/ reel spp yes non dry rev 2.3 page 1 2013-11-07
BSL802SN parameter symbol conditions unit min. typ. max. thermal characteristics thermal resistance, junction - minimal footprint r thjs - - 50 k/w smd version, device on pcb r thja minimal footprint - - 230 6 cm 2 cooling area 1) - - 62.5 electrical characteristics, at t j =25 c, unless otherwise specified static characteristics drain-source breakdown voltage v (br)dss v gs = 0?v, i d =?250 a 20 - - v gate threshold voltage v gs(th) v ds =v gs , i d =30?a 0.3 0.55 0.75 drain-source leakage current i dss v ds =20?v, v gs =0?v, t j =25?c - - 1 m a v ds =20?v, v gs =0?v, t j =150?c - - 100 gate-source leakage current i gss v gs =8?v, v ds =0?v - - 100 na drain-source on-state resistance r ds(on) v gs =1.8?v, i d =3.6?a - 23 31 m w v gs =2.5?v, i d =7.5?a - 18 22 transconductance g fs | v ds |>2| i d | r ds(on)max , i d =6?a 25 - s values 1) device on 40 mm x 40 mm x 1.5 mm epoxy pcb fr4 with 6 cm 2 (single layer, 70 m thick) copper area for drain connection. pcb is vertical in still air. (t < 5 sec.) rev 2.3 page 2 2013-11-07
BSL802SN parameter symbol conditions unit min. typ. max. dynamic characteristics input capacitance c iss - 1013 1347 pf output capacitance c oss - 290 385 reverse transfer capacitance c rss - 51 77 turn-on delay time t d(on) - 10 - ns rise time t r - 30 - turn-off delay time t d(off) - 20 - fall time t f - 5.5 - gate charge characteristics gate to source charge q gs - 1.6 - nc gate to drain charge q gd - 1.6 - gate charge total q g - 4.7 - gate plateau voltage v plateau - 1.5 - v reverse diode diode continous forward current i s - - 1.8 a diode pulse current i s,pulse - - 30 diode forward voltage v sd v gs =0?v, i f =7.5?a, t j =25?c - 0.86 1.1 v reverse recovery time t rr - 15 - ns reverse recovery charge q rr - 5.1 - nc v r =10?v, i f =7.5 a, d i f /d t =100?a/s t a =25?c values v gs =0?v, v ds =10?v, f =1?mhz v dd =10?v, v gs =2.5?v, i d =3.7?a, r g,ext =6? w v dd =10?v, i d =7.5?a, v gs =0?to?2.5?v rev 2.3 page 3 2013-11-07
BSL802SN 1 power dissipation 2 drain current p tot =f( t a ) i d =f( t a ); v gs 2.5 v 3 safe operating area 4 max. transient thermal impedance i d =f( v ds ); t a =25 c; d =0 z thja =f( t p ) parameter: t p parameter: d = t p / t 10 s 100 s 1 ms 10 ms 5s 10 - 2 10 - 1 10 0 10 1 10 2 10 - 3 10 - 2 10 - 1 10 0 10 1 10 2 i d [a] v ds [v] limited by on - state resistance single pulse 0.01 0.02 0.05 0.1 0.2 0.5 10 - 5 10 - 4 10 - 3 10 - 2 10 - 1 10 0 10 1 10 - 1 10 0 10 1 10 2 z thja [k/w] t p [s] 0 0.4 0.8 1.2 1.6 2 0 40 80 120 160 p tot [w] t a [ c] 0 1 2 3 4 5 6 7 8 0 40 80 120 160 i d [a] t a [ c] rev 2.3 page 4 2013-11-07
BSL802SN 5 typ. output characteristics 6 typ. drain-source on resistance i d =f( v ds ); t j =25 c r ds(on) =f( i d ); t j =25 c parameter: v gs parameter: v gs 7 typ. transfer characteristics 8 typ. forward transconductance i d =f( v gs ); | v ds |>2| i d | r ds(on)max g fs =f( i d ); t j =25 c 0 5 10 15 20 25 30 0 1 2 3 4 5 6 7 8 g fs [s] i d [a] 25 c 150 c 0 1 2 3 4 5 6 7 8 0 1 2 i d [a] v gs [v] 1.1 v 1.2 v 1.3 v 1.4 v 1.5 v 1.6 v 1.8 v 2.5 v 0 0 2 4 6 8 0 0.2 0.4 0.6 0.8 1 i d [a] v ds [v] 1.2 v 1.3 v 1.4 v 1.5 v 1.6 v 1.8 v 2.5 v 0 10 20 30 40 50 60 70 80 0 2 4 6 8 r ds(on) [m w ] i d [a] rev 2.3 page 5 2013-11-07
BSL802SN 9 drain-source on-state resistance 10 typ. gate threshold voltage r ds(on) =f( t j ); i d =7.5 a; v gs =2.5 v v gs(th) =f( t j ); v ds =v gs ; i d =30 a parameter: i d 11 typ. capacitances 12 forward characteristics of reverse diode c =f( v ds ); v gs =0 v; f =1 mhz; t j =25c i f =f( v sd ) parameter: t j typ 98 % 0 10 20 30 40 - 60 - 20 20 60 100 140 180 r ds(on) [m w ] t j [ c] typ 98 % 2 % - 0.4 0 0.4 0.8 1.2 - 60 - 20 20 60 100 140 180 v gs(th) [v] t j [ c] ciss coss crss 10 1 10 2 10 3 10 4 0 5 10 15 20 c [pf] v ds [v] 25 c 150 c 25 c, 98% 150 c, 98% 10 - 3 10 - 2 10 - 1 10 0 10 1 0 0.2 0.4 0.6 0.8 1 1.2 i f [a] v sd [v] rev 2.3 page 6 2013-11-07
BSL802SN 13 avalanche characteristics 14 typ. gate charge i as =f( t av ); r gs =25 w v gs =f( q gate ); i d =7.5 a pulsed parameter: t j(start) parameter: v dd 15 drain-source breakdown voltage 16 gate charge waveforms v br(dss) =f( t j ); i d =250 a 16 17 18 19 20 21 22 23 24 25 - 60 - 20 20 60 100 140 v br(dss) [v] t j [ c] 4 v 10 v 16 v 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 0 1 2 3 4 5 6 7 8 9 10 v gs [v] q gate [nc] 25 c 100 c 125 c 10 0 10 1 10 2 10 3 10 - 1 10 0 10 1 i av [a] t av [s] rev 2.3 page 7 2013-11-07 v gs q gate v gs(th) q g(th) q gs q gd q sw q g
BSL802SN package outline: footprint: packaging: dimensions in mm tsop6 rev 2.3 page 8 2013-11-07
BSL802SN published by infineon technologies ag 81726 munich, germany ? 2008 infineon technologies ag all rights reserved. legal disclaimer the information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies components may be used in life-support devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered. rev 2.3 page 9 2013-11-07
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